Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652084 | Flat lead package formation method | Thorsten Meyer, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
GO
Gerald Ofner
Overall (2023): #439,742 of 537,848Top 85%
1
Patents 2023