Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652012 | Inorganic encapsulant for electronic component with adhesion promoter | Edmund Riedl, Steffen Jordan, Stefan Schwab | 2023-05-16 |
| 11652084 | Flat lead package formation method | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |