Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Meyer, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |
| 11569186 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2023-01-31 |