Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791255 | Die package and method of forming a die package | — | 2023-10-17 |
| 11792941 | Circuit board structure and method for manufacturing a circuit board structure | Risto Tuominen, Antti Iihola | 2023-10-17 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11664304 | Semiconductor module | Sergey Yuferev, Robert Fehler, Angela Kessler, Gerhard Noebauer | 2023-05-30 |
| 11632860 | Power electronic assembly and method of producing thereof | Martin Benisek, Liu Chen, Frank Daeche, Josef Maerz | 2023-04-18 |
| 11569186 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2023-01-31 |