Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817617 | Antenna package with via structure and method of formation thereof | Ashutosh Baheti, Saverio Trotta | 2023-11-14 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |