Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817430 | Semiconductor module | Angela Kessler, Gerhard Noebauer | 2023-11-14 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Ralf Otremba, Fabian Schnoy | 2023-10-03 |