Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776882 | Method of fabricating a semiconductor package | Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11728309 | Clip having locking recess for connecting an electronic component with a carrier in a package | Melvin Levardo, Ryan Ross Agbay Alinea | 2023-08-15 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |