Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Meyer, Thorsten Scharf, Peter Strobel | 2023-07-25 |
| 11676879 | Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier | Chee Yang Ng | 2023-06-13 |