Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848377 | Semiconductor component with edge termination region | Hans-Joachim Schulze, Matteo Dainese, Elmar Falck, Franz-Josef Niedernostheide, Manfred Pfaffenlehner | 2023-12-19 |
| 11837528 | Method of manufacturing a semiconductor device having a bond wire or clip bonded to a bonding pad | Hans-Joachim Schulze | 2023-12-05 |
| 11764296 | Method for manufacturing a semiconductor device | Johannes Georg Laven, Hans-Joachim Schulze, Werner Schustereder | 2023-09-19 |
| 11735633 | Silicon carbide device with trench gate structure and method of manufacturing | Ralf Siemieniec, Rudolf Elpelt | 2023-08-22 |
| 11728420 | Mesa contact for a power semiconductor device and method of producing a power semiconductor device | Hans-Juergen Thees | 2023-08-15 |
| 11721616 | Semiconductor package with signal distribution element | Stephan Voss, Edward Fuergut, Martin Gruber, Andreas Huerner | 2023-08-08 |
| 11695083 | Power diode and method of manufacturing a power diode | Mario Barusic, Markus Beninger-Bina, Matteo Dainese | 2023-07-04 |
| 11688732 | Short circuit protection structure in MOS-gated power devices | Guang Zeng, Joachim Weyers | 2023-06-27 |
| 11664464 | Diode and method of producing a diode | Guang Zeng, Moritz Hauf | 2023-05-30 |
| 11600701 | Semiconductor component having a SiC semiconductor body | Andreas Meiser, Caspar Leendertz | 2023-03-07 |
| 11552172 | Silicon carbide device with compensation layer and method of manufacturing | Caspar Leendertz, Romain Esteve, Moriz Jelinek, Hans-Joachim Schulze, Werner Schustereder | 2023-01-10 |