Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber, Hans-Joachim Schulze | 2023-06-27 |
| 11682611 | Power semiconductor module | Michael Niendorf, Ludwig Busch, Oliver Markus Kreiter, Christian Neugirg | 2023-06-20 |
| 11646258 | Electronic devices including electrically insulated load electrodes | Edward Fuergut, Thomas Basler, Reinhold Bayerer | 2023-05-09 |
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Timo Bohnenberger, Andreas Grassmann, Martin Mayer, Alexander Roth, Franz Zollner | 2023-04-11 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |
| 11598904 | Power semiconductor module and method for producing a power semiconductor module | Dirk Ahlers, Andreas Grassmann, Andre Uhlemann | 2023-03-07 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Wolfram Hable, Andreas Grassmann, Frank Winter, Christian Neugirg | 2023-02-07 |