Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim | 2023-12-12 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Tian See Hoe, Elvis Keli +7 more | 2023-04-04 |