Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mei Fen Hiew | 2023-12-12 |