Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2023-12-12 |
| 11705387 | Multi-layer interconnection ribbon | Emil Lamco Jocson, Ryan Tordillo Comadre | 2023-07-18 |