Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Mohd Afiz Hashim, Mei Fen Hiew | 2023-12-12 |
| 11652078 | High voltage semiconductor package with pin fit leads | Edmund Sales Cabatbat, Kean Ming Koe, Ke Yan Tean | 2023-05-16 |