Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit +2 more | 2023-10-31 |
| 11652078 | High voltage semiconductor package with pin fit leads | Edmund Sales Cabatbat, Thai Kee Gan, Kean Ming Koe | 2023-05-16 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |
| 11600547 | Semiconductor package with expanded heat spreader | Jo Ean Joanna Chye, Teck Sim Lee, Wei Wang | 2023-03-07 |