Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11791238 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Azlina Kassim, Hui Kin Lit | 2023-10-17 |