Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11600547 | Semiconductor package with expanded heat spreader | Jo Ean Joanna Chye, Ke Yan Tean, Wei Wang | 2023-03-07 |