Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Teck Sim Lee, Klaus Schiess, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |