Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682611 | Power semiconductor module | Michael Niendorf, Ludwig Busch, Christian Neugirg, Ivan Nikitin | 2023-06-20 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe, Elvis Keli +7 more | 2023-04-04 |