Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682611 | Power semiconductor module | Michael Niendorf, Ludwig Busch, Oliver Markus Kreiter, Ivan Nikitin | 2023-06-20 |
| 11631628 | Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same | Peter Scherl | 2023-04-18 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Wolfram Hable, Andreas Grassmann, Frank Winter, Ivan Nikitin | 2023-02-07 |