Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652084 | Flat lead package formation method | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich +1 more | 2023-05-16 |
| 11631628 | Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same | Christian Neugirg | 2023-04-18 |