Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652078 | High voltage semiconductor package with pin fit leads | Edmund Sales Cabatbat, Thai Kee Gan, Ke Yan Tean | 2023-05-16 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |