Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804383 | Method for producing a metal-ceramic substrate with electrically conductive vias | — | 2023-10-31 |
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Ivan Nikitin, Timo Bohnenberger, Andreas Grassmann, Martin Mayer, Franz Zollner | 2023-04-11 |
| 11606154 | Wideband spectrum analyzer | — | 2023-03-14 |
| 11557490 | Method for producing a metal-ceramic substrate with at least one via | — | 2023-01-17 |
| 11557522 | Method for producing power semiconductor module arrangement | Olaf Hohlfeld | 2023-01-17 |
| 11552042 | Solder material with two different size nickel particles | Alexander Heinrich, Catharina Wille | 2023-01-10 |