Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Carsten von Koblinski, Matteo Piccin, Roland Rupp, Chiew Li Tai, Jia Yi Wong | 2023-09-12 |
| 11688670 | Semiconductor package and method for fabricating a semiconductor package | Ralf Otremba, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff | 2023-06-27 |