Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Carsten von Koblinski, Daniel Pedone, Matteo Piccin, Roland Rupp, Jia Yi Wong | 2023-09-12 |