Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Carsten von Koblinski, Daniel Pedone, Roland Rupp, Chiew Li Tai, Jia Yi Wong | 2023-09-12 |
| 11576259 | Carrier, laminate and method of manufacturing semiconductor devices | Hans-Joachim Schulze, Andre Brockmeier, Tobias Franz Wolfgang Hoechbauer, Gerhard Metzger-Brueckl, Francisco Javier Santos Rodriguez | 2023-02-07 |