Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl +1 more | 2023-12-19 |
| 11756917 | Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device | Daniel Pedone, Matteo Piccin, Roland Rupp, Chiew Li Tai, Jia Yi Wong | 2023-09-12 |
| 11605599 | Semiconductor device having a thin semiconductor die | Christian Gruber, Benjamin Bernard, Tobias Polster | 2023-03-14 |