Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Martin Poelzl +1 more | 2023-12-19 |
| 11685108 | Method of 3D printing a cellular solid | Claas Willem Visser, Dahlia Amato, Jennifer A. Lewis | 2023-06-27 |