Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2023-12-19 |
| 11699725 | Semiconductor device having an alignment layer with mask pits | Oliver Blank, Franz Hirler, Maximilian Roesch, Li Juin Yip | 2023-07-11 |
| 11552016 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2023-01-10 |
| 11545545 | Superjunction device with oxygen inserted Si-layers | Robert Haase, Sylvain Leomant, Maximilian Roesch, Ravi Keshav Joshi, Andreas Meiser +2 more | 2023-01-03 |