Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Jochen Mueller, Martin Poelzl +1 more | 2023-12-19 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more | 2023-08-01 |
| 11637028 | Method and apparatus for use in wafer processing | Thomas Fischer, Walter Leitgeb, Michael Lecher | 2023-04-25 |