Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833617 | Splitting of a solid using conversion of material | Jan Richter, Christian Beyer | 2023-12-05 |
| 11822307 | Laser conditioning of solid bodies using prior knowledge from previous machining steps | Marko Swoboda, Jan Richter, Franz Schilling | 2023-11-21 |
| 11787083 | Production facility for separating wafers from donor substrates | Marko Swoboda, Christian Beyer, Albrecht Ullrich, Jan Richter | 2023-10-17 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf, Gerald Lackner +4 more | 2023-08-01 |
| 11664277 | Method for thinning solid-body layers provided with components | Marko Swoboda, Jan Richter | 2023-05-30 |
| 11551981 | Method and apparatus for producing at least one modification in a solid body | Marko Swoboda, Albrecht Ullrich | 2023-01-10 |