Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11822307 | Laser conditioning of solid bodies using prior knowledge from previous machining steps | Ralf Rieske, Jan Richter, Franz Schilling | 2023-11-21 |
| 11787083 | Production facility for separating wafers from donor substrates | Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter | 2023-10-17 |
| 11772201 | Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components | Jan Richter | 2023-10-03 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more | 2023-08-01 |
| 11664277 | Method for thinning solid-body layers provided with components | Ralf Rieske, Jan Richter | 2023-05-30 |
| 11557506 | Methods for processing a semiconductor substrate | Werner Schustereder, Alexander Breymesser, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Wolfgang Lehnert +1 more | 2023-01-17 |
| 11551981 | Method and apparatus for producing at least one modification in a solid body | Ralf Rieske, Albrecht Ullrich | 2023-01-10 |