Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833617 | Splitting of a solid using conversion of material | Jan Richter, Ralf Rieske | 2023-12-05 |
| 11787083 | Production facility for separating wafers from donor substrates | Marko Swoboda, Ralf Rieske, Albrecht Ullrich, Jan Richter | 2023-10-17 |
| 11699616 | Method for producing a layer of solid material | Wolfram Drescher, Jan Richter | 2023-07-11 |