Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833617 | Splitting of a solid using conversion of material | Christian Beyer, Ralf Rieske | 2023-12-05 |
| 11822307 | Laser conditioning of solid bodies using prior knowledge from previous machining steps | Marko Swoboda, Ralf Rieske, Franz Schilling | 2023-11-21 |
| 11786995 | Nonplanar wafer and method for producing a nonplanar wafer | — | 2023-10-17 |
| 11787083 | Production facility for separating wafers from donor substrates | Marko Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich | 2023-10-17 |
| 11772201 | Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components | Marko Swoboda | 2023-10-03 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more | 2023-08-01 |
| 11699616 | Method for producing a layer of solid material | Wolfram Drescher, Christian Beyer | 2023-07-11 |
| 11664277 | Method for thinning solid-body layers provided with components | Ralf Rieske, Marko Swoboda | 2023-05-30 |