Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810779 | Method of porosifying part of a semiconductor wafer | Sophia Friedler, Iris Moder, Ingo Muri | 2023-11-07 |
| 11742215 | Methods for forming a semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Matthias Kuenle, Helmut Oefner, Francisco Javier Santos Rodriguez +1 more | 2023-08-29 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Heimo Graf, Gerald Lackner +4 more | 2023-08-01 |