Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Evelyn Napetschnig, Michael Rogalli | 2023-08-22 |
| 11557505 | Method of manufacturing a template wafer | Rudolf Berger, Rudolf Lehner, Gerhard Metzger-Brueckl, Guenther Ruhl | 2023-01-17 |
| 11557506 | Methods for processing a semiconductor substrate | Werner Schustereder, Alexander Breymesser, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Hans-Joachim Schulze +1 more | 2023-01-17 |