Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776927 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2023-10-03 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Michael Rogalli | 2023-08-22 |
| 11615963 | Electronic device, electronic module and methods for fabricating the same | Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz +6 more | 2023-03-28 |