Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |