Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804415 | Semiconductor device with first and second portions that include silicon and nitrogen | Markus Kahn, Philipp Koch, Angelika Koprowski, Christian Maier, Gerhard Schmidt +1 more | 2023-10-31 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Thomas Rupp +2 more | 2023-09-19 |