Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig | 2023-08-22 |
MR
Michael Rogalli
Overall (2023): #321,779 of 537,848Top 60%
1
Patents 2023