Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2023-08-22 |
JG
Johann Gatterbauer
Overall (2023): #390,119 of 537,848Top 75%
1
Patents 2023