Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688670 | Semiconductor package and method for fabricating a semiconductor package | Ralf Otremba, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2023-06-27 |
| 11615963 | Electronic device, electronic module and methods for fabricating the same | Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz, Kamil Karlovsky +6 more | 2023-03-28 |
| 11581194 | Sintering method using a sacrificial layer on the backside metallization of a semiconductor die | Frederik Otto | 2023-02-14 |