Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581194 | Sintering method using a sacrificial layer on the backside metallization of a semiconductor die | Paul Frank | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581194 | Sintering method using a sacrificial layer on the backside metallization of a semiconductor die | Paul Frank | 2023-02-14 |