Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787686 | Method for processing a layer structure and microelectromechanical component | Wolfgang Friza, Daniel Maurer | 2023-10-17 |
| 11576259 | Carrier, laminate and method of manufacturing semiconductor devices | Hans-Joachim Schulze, Tobias Franz Wolfgang Hoechbauer, Gerhard Metzger-Brueckl, Matteo Piccin, Francisco Javier Santos Rodriguez | 2023-02-07 |