Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more | 2022-12-20 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11437283 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2022-09-06 |
| 11424160 | Self-aligned local interconnects | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more | 2022-08-23 |
| 11406972 | Activation of protected cross-linking catalysts during formation of dielectric materials | James M. Blackwell, David J. Michalak, Jessica M. Torres, Marie Krysak | 2022-08-09 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Nafees Kabir +2 more | 2022-08-02 |