Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Ji-Yong Park, Siddharth K. Alur, Cheng Xu, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Yikang Deng, Jonathan L. Rosch, Junnan Zhao | 2022-11-08 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee | 2022-11-08 |
| 11444042 | Magnetic structures in integrated circuit packages | Ying Wang, Chong Zhang, Lauren A. Link, Yikang Deng | 2022-09-13 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng +2 more | 2022-07-05 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11317955 | Magnesium enhanced/induced bone formation | Charles S. Sfeir, Amy Chaya, Sayuri Smith | 2022-05-03 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Sai Vadlamani, Prithwish Chatterjee, Lauren A. Link | 2022-03-29 |
| 11276618 | Bi-layer prepreg for reduced dielectric thickness | Jonathan L. Rosch | 2022-03-15 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2022-02-15 |