Issued Patents 2021
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10901317 | Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening | Benjamin D. Briggs, Michael Rizzolo, Ekmini Anuja De Silva, Lawrence A. Clevenger | 2021-01-26 |
| 10903162 | Fuse element resistance enhancement by laser anneal and ion implantation | Liying Jiang, Juntao Li, Michael Rizzolo, Yi Song | 2021-01-26 |
| 10903161 | Back end of line metallization structure | Raghuveer R. Patlolla, James J. Kelly, Cornelius Brown Peethala | 2021-01-26 |
| 10903117 | Fabricating vias with lower resistance | Baozhen Li, Andrew Tae Kim | 2021-01-26 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, Koichi Motoyama, James J. Kelly, Hosadurga Shobha | 2021-01-26 |
| 10903115 | Controlling grain boundaries in high aspect-ratio conductive regions | Conal E. Murray | 2021-01-26 |
| 10896846 | Controlling performance and reliability of conductive regions in a metallization network | Raghuveer R. Patlolla, Cornelius Brown Peethala | 2021-01-19 |
| 10886166 | Dielectric surface modification in sub-40nm pitch interconnect patterning | Nicholas Anthony Lanzillo | 2021-01-05 |
| 10886225 | BEOL alternative metal interconnects: integration and process | Theo Standaert | 2021-01-05 |
| 10886168 | Surface modified dielectric refill structure | Terry A. Spooner, Koichi Motoyama, Shyng-Tsong Chen | 2021-01-05 |