Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11069567 | Modulating metal interconnect surface topography | Chih-Chao Yang | 2021-07-20 | $5,541,000 |
| 10903115 | Controlling grain boundaries in high aspect-ratio conductive regions | Chih-Chao Yang | 2021-01-26 | $1,788,000 |