Issued Patents 2020
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2020-08-04 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2020-07-14 |
| 10707084 | Method of manufacturing wafer level chip scale package | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-07-07 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Alexander Kalnitsky, Ming-Che Ho +3 more | 2020-06-30 |
| 10692838 | Semiconductor packages | Zi-Jheng Liu, Chen-Cheng Kuo | 2020-06-23 |
| 10685896 | Integrated circuit package and method of fabricating the same | Zi-Jheng Liu, Yu-Hsiang Hu | 2020-06-16 |
| 10665545 | Semiconductor devices, semiconductor packages and methods of forming the same | Sih-Hao Liao, Yu-Hsiang Hu, Meng-Che Tu | 2020-05-26 |
| 10658199 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2020-05-19 |
| 10658287 | Semiconductor device having a tapered protruding pillar portion | Sih-Hao Liao, Yu-Hsiang Hu | 2020-05-19 |
| 10658208 | Polyimide composition for package structure, package structure and method of fabricating the same | Sih-Hao Liao, Yu-Hsiang Hu | 2020-05-19 |
| 10643916 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2020-05-05 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2020-04-21 |
| 10622321 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Hui-Jung Tsai, Tsao-Lun Chang | 2020-04-14 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu | 2020-03-31 |
| 10529675 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2020-01-07 |
| 10529593 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Po-Han Wang, Yu-Hsiang Hu | 2020-01-07 |