Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879207 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10879210 | Bonded structures | Paul M. Enquist, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2020-11-24 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Akash Agrawal | 2020-09-29 |
| 10748858 | High yield substrate assembly | Ilyas Mohammed, Masud Beroz | 2020-08-18 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi | 2020-05-19 |
| 10629577 | Direct-bonded LED arrays and applications | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-04-21 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Guilian Gao, Arkalgud R. Sitaram | 2020-04-14 |
| 10600761 | Nanoscale interconnect array for stacked dies | Bongsub Lee, Belgacem Haba, Sangil Lee | 2020-03-24 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Cyprian Emeka Uzoh | 2020-03-10 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10546832 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-01-28 |
| 10546834 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Rajesh Katkar | 2020-01-28 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2020-01-07 |